A recent journal article reported by Prof. Leung’s group is featured in the cover page of the Journal of Applied Polymer Science in January 2016 (Volume 133, Issue 4). This paper reports their work to develop thermally conductive polymer matrix composites (PMC) by foaming-assisted networking of micro- and submicron-scale hexagonal boron nitride. It provides new processing strategies to manufacture flexible and/or light-weight thermally conductive materials for thermal management applications in flexible and portable electronics.